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Alleged Kirin 970 Chipset Configuration Fully Revealed in a Leaked Image

Huawei Mate 10 render

Huawei has confirmed that its forthcoming flagship named Huawei Mate 10 will be powerful enough to take on the rumored iPhone 8. The Mate 10 that is expected to debut in October 2017 will be powered by the unannounced Kirin 970 chipset. A leaked shot has surfaced to reveal the entire configuration of the chipset.

Kirin 970 configuration

The HiSilicon Kirin 970 will be a flagship 10nm 64-bit chipset that includes four cores of Cortex A73 working at 2.8 GHz and four cores of Cortex A53. It will be equipped with Mali-G72 MP8 graphics. Some rumors had claimed that it would be coming with ARM Heimdallr GPU. The octa-core processor can deliver a maximum processing speeds of up to 2.8 GHz.

The CPU is coupled with 32-bit dual channel 1866 MHz LPDDR4 RAM working at 29.8 GB/s. The leaked image states that it will feature a Cat. 12 LTE modem and will carry support for 2.4/5 GHz dual band Wi-Fi 802.11 a/b/g/n/ac. It can support up to 42-megapixel dual ISP. It also supports dual SIM LTE. The Huawei Mate 10 will be also coming with an AI chip.

Rumors have revealed that the Mate 10 would be equipped with 6.1-inch bezel-less display. Other rumored specs include 6 GB of RAM, 64 GB of native storage, Leica branded dual cameras and 4,000mAh capacity battery. As far as Kirin 970 announcement, the leaked shot states that is would be getting official within Q3 2017.


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