Snapdragon 845 Mobile Platform’s Detailed Specs Officially Confirmed

by Anvinraj Valiyathara 0

On the first day of the Snapdragon Tech Summit event in Hawaii, Qualcomm had announced the Snapdragon 845 Mobile Platform that would be powering many flagship phones arriving next year. As promised, the U.S. based chip maker has revealed detailed information on the Snapdragon 845 chipset at the second day of the event.

The Snapdragon 845 chipset is 30 percent more efficient compared to the predecessor Snapdragon 835. The Adreno 630 graphics of the SD 845 produces 30 percent better graphics. Also, the new GPU offers enhanced video rending and consumes less power compared to Adreno 540 graphics.

Built with 10nm FinFET manufacturing process, the Snapdragon 845 is an octa-core processor that includes four ARM cores of Kryo 385 Gold working at 2.8 GHz and four ARM cores of Kryo 385 Silver working at 1.8 GHz. It supports 4 x 16-bit LPDDR4x RAM

It also includes a Hexagon 685 Digital Signal Processor for Artificial Intelligence and imaging, AQustic Audio, and Snapdragon X20 Gigabit LTE modem. Once AT&T, T-Mobile and Verizon begins the deployment of high-speed LTE in various regions in the U.S., the Cat. 18 LTE modem will be able to deliver maximum download speeds of 1.2 Gbps and upload speeds of 150 Mbps as well as support dual SIM-dual VoLTE.

The inclusion of Spectra 280 Image Signal Processor will let users to shoot 4K HDR videos at 60 fps on Snapdragon 845 powered smartphones. It also supports capturing of slow-motion videos of HD quality at 480 fps. The Snapdragon 845 SoC also supports wide range of biometric recognition feature such as fingerprint, iris, voice and face.