Earlier this month, MediaTek announced the Dimensity 9300, a flagship chipset. The recently unveiled Vivo X100 and X100 Pro are the first phones to feature the D9300 chip. Today, the brand confirmed that it will unveil the Dimensity 8300, a sub-flagship chip, at 3 pm (local time) on Nov. 21 in China. Here is a look at what to expect from the new chip.
According to reports, the Dimensity 8300 will be equipped with a single Cortex-X3 high-performance core running at 2.8GHz, along with three Cortex-A715 performance cores clocked at 2.4GHz. Additionally, the chipset is rumored to include four Cortex-A510 efficiency cores operating at 1.6GHz. The graphics processing unit (GPU) is reported to be an Immortalis G520 MC6 with a frequency of 850MHz, promising a powerful and versatile performance.
While there is no official confirmation regarding the smartphones that will integrate the new chip, it appears likely that at least one phone equipped with the said chip will be introduced in China shortly after the official announcement.
Last year, the iQOO Neo 7 SE debuted as the first Dimensity 8200 phone in December 2022. The Redmi K60e, featuring the same chip, was announced a few days later in the same month.
Although iQOO launched the Neo 8 series earlier this year in China, it did not announce the Neo 8 SE, and there have also been no rumors about the Neo 9 SE. Hence, it appears that the Redmi K70e could be the first phone to feature the D8300 chip. As per recent reports, the K70e will have a 1.5K OLED display and a 5,500mAh battery with 90W fast charging support.
