Prolific leaker Digital Chat Station revealed that Honor’s Magic 7 series of smartphones will be announced in November of this year in China. Today, the tipster took to Weibo to share a schematic of an upcoming flagship phone. While he has not specified the name of the device, it seems that he may have shared the design of the Magic 7 Pro.
Honor Magic 7 Pro design revealed
The above image shows a large camera housing, which is not a perfect circle. It appears that it includes three cameras and an LED flash. The volume rocker and power button are available on the right edge of the phone.
The leaker added that the front of this phone features a micro-curved display equipped with 3D face recognition sensors. This indicates that the display may feature a pill-shaped cutout for housing the front camera and the complex sensors for 3D face unlock. These details are enough to suggest that the above schematic may belong to the Honor Magic 7 Pro.
According to reports, the Honor Magic 7 Pro will come equipped with the Snapdragon 8 Gen 4 chipset. It may draw power from a battery of around 6,000mAh capacity.
An OIS-enabled 50-megapixel OmniVision OV50K main camera could lead the Magic 7 Pro’s rear camera setup. A 50-megapixel ultra-wide lens and a 180-megapixel or 200-megapixel Samsung HP3 periscope telephoto camera will accompany it.
The camera module is also expected to house a LiDAR sensor and a color temperature sensor. It is expected to run on Android 15 and Magic OS 9.0.
