The HTC U11 Plus flagship smartphone is expected to get announced on Nov. 2. The alleged phone has already appeared on Geekbench and GFXBench benchmarking platforms. Well-known leakster @OnLeaks and an Indian publication have collaborated to release CAD renders of the HTC U11 Plus.
The above image suggests that the back panel of the HTC U11 Plus may use the same “Liquid Surface” that is available on the HTC U11 flagship. The smartphone is expected to arrive with slim bezels. However, the upper and lower bezels of the phone seem to be thick.
The U11 Plus renders reveals that it won’t be featuring a 3.5mm audio jack. It means users will have to use the USB-C port of the phone to connect wired headphones. The backside of the phone features a single camera lens and the fingerprint scanner is placed below it. It is expected to measure 158.2 x 74.6 x 9.1mm.
The upcoming U11 Plus flagship phone will be driven by Snapdragon 835 chipset. It is expected to arrive in two variants such as 4 GB of RAM + 64 GB of storage and 6 GB of RAM + 128 GB of storage. Recent reports have suggested that only specific markets will be receiving the 6 GB RAM model of the U11 Plus.
The U11 Plus is expected to house a 6-inch display that will be delivering a QHD+ resolution of 2,880 x 1,440 pixels. It will be delivering an aspect ratio of 18:9. It is pegged to feature a 4,000mAh battery.
