Meizu has recently unveiled its first full screen design smartphone – the Meizu M6S. The company has already confirmed that the Meizu 15 Plus smartphone will be released to celebrate 15th anniversary of the company. The Chinese manufacturer is expected to debut the Meizu 15 alongside the 15 Plus smartphone. Fresh renders of the Meizu 15 Plus have surfaced on Weibo to reveal the front and rear design of the phone.
The above image shows that expect for the upper side, the smartphone features narrow bezels on all the three sides. The top bezel is slightly thick probably because it would be housing various sensors like selfie camera. The image showing the backside of the phone reveals that the vertically stacked dual camera setup will be available on the Meizu 15 Plus. It seems that the module that is found below the dual camera setup is the fingerprint sensor or it could be a ring flash.
Previous rumors have claimed that the Snapdragon 835 will be powering the Meizu 15 Plus whereas the smaller Meizu 15 will feature Snapdragon 660. However, today’s leak states that the Meizu 15 Plus might arrive in Snapdragon 845 and Exynos 8895 chipset models. The Meizu 15 and 15 Plus are confirmed to debut around the Spring Festival season in February in China. Both phones are expected to go on sale in the home country in March.
