Redmi has officially confirmed that the Redmi K70e, which will launch with the Redmi K70 and K70 Pro this month in China, will feature the Dimensity 8300-Ultra chipset. The standard and Pro models are expected to feature the Snapdragon 8 Gen 2 and Snapdragon 8 Gen 3 chipsets, respectively. A hands-on video of the Redmi K70e, revealing its design and key specifications has emerged on Weibo. Here is a look at what to expect from the device.
Redmi K70e specifications (rumored)
According to reports, the Redmi K70e is expected to debut with a 6.67-inch OLED display, offering an impressive 1.5K resolution and a smooth 120Hz refresh rate. In the camera department, the Redmi K70e is said to feature a 16-megapixel selfie camera, along with a versatile rear camera setup consisting of a 64-megapixel primary camera equipped with OIS, an 8-megapixel ultra-wide camera lens, and a 2-megapixel macro lens.
Powered by the Dimensity 8300-Ultra chipset, the device is set to deliver high performance and will be available with up to 16 GB of LPDDR5x RAM and up to 1 TB of UFS 4.0 storage. To ensure extended usage, it will house a substantial 5,500mAh battery, supporting rapid 90W fast charging. Other notable features include the HyperOS-based Android 14, an in-display fingerprint sensor for enhanced security, a glass back, and a plastic frame for durability. It is expected to be a thin device, measuring 8.09mm, and a weight of 198 grams.
The Redmi K70e has the 2311DRK48C model number, while the upcoming Poco F6 5G’s global and Indian variants have similar model numbers, such as 2311DRK48G and 2311DRK48I, respectively. This indicates that the K70e will be rebranded as the Poco F6 in the global market.
As far as the Poco F6 Pro is concerned, it is expected to be a rebranded version of the Redmi K70, which is expected to feature the Snapdragon 8 Gen 2. The Poco F6 series is expected to be released in the first quarter of 2024.
