A report that surfaced yesterday had revealed that since Qualcomm has awarded the contract of manufacturing the Snapdragon 845 to TSMC instead of Samsung, the latter has allegedly decided to rely less on Snapdragon chipset for the upcoming Galaxy S9 and Galaxy S9+ duo. Speculations indicate more than half units of the Galaxy S9 duo would be powered by the next-generation Exynos 9810 chipset.
A Chinese leakster has revealed that the Exynos 9810 may include four cores of Samsung’s Mongoose M3 CPU cores and four cores of ARM’s Cortex A55. The chipset is expected to include Mali G71 MP18 graphics and offers high-speed LTE connectivity through Cat. 18 LTE model with CDMA support. It will be built with Samsung’s 10nm FinFET Low Power Plus (LPP) process.
The leakster claims that the U.S. edition of Galaxy S9 may come powered with Snapdragon 845. The Exynos 9810 chipset may power the global edition of the Galaxy S9.
Since the Galaxy Note 8 is expected to come with dual rear cameras, the Galaxy S9 and S9+ are rumored to come with dual rear cameras. Both the smartphones are expected to get unleashed in the first quarter of 2018.
