Qualcomm will unveil the Snapdragon 8 Elite Gen 5 chipset during the upcoming 2025 Snapdragon Summit, which will be held between Sept. 23 and 25. There have been reports that MediaTek will also announce its flagship chipset just before Qualcomm’s event. Today, the brand released an official confirmation that the Dimensity 9500 will debut on Sept. 22 in China.
MediaTek Dimensity 9500 specifications (rumored)
MediaTek is yet to confirm the specifications of the Dimensity 9500, but the upcoming phones featuring the new chip have already appeared on Geekbench. The Geekbench listings of the upcoming Vivo X300 series and the Oppo Find X9 lineup have revealed the key specifications of the chipset.
The Dimensity 9500 Geekbench listings reveal that it will adopt a 1+3+4 CPU architecture. It will have one high-performance core working at 4.21GHz, three supporting cores operating at 3.50GHz, and four efficiency cores running at 2.70GHz.
For graphics, the Dimensity 9500 chip is equipped with the Mali-G1 Ultra MC12 GPU. The new chip is expected to bring 40 percent improvements in the graphics department compared to the Dimensity 9400 from last year. As per reports, the D9500 will be a 3nm chipset built by TSMC.
The Taiwanese chipset maker has also confirmed that it is working on a 2nm chip, which will debut in the second half of 2026. While it has not confirmed the name of the chip, it appears that the brand could be referring to the Dimensity 9600, which will power flagship phones in 2026.
As far as the Dimensity 9500 is concerned, the Vivo X300 series, which is expected to debut on Oct. 13 in China, will be the first phones to feature it. The chip will also power the Oppo Find X9 Pro and the iQOO Neo 11 Pro.
