Qualcomm has recently launched the Snapdragon 845 mobile platform that will be powering the next-generation flagship phones that will be launching in 2018. Leaked information has revealed that the U.S. based chipmaker will be debuting Snapdragon 670, Snapdragon 640 and Snapdragon 460 chipsets in 2018.
The Snapdragon 670 will be arriving as the successor of Snapdragon 660. It is rumored to be a 10nm chipset that will feature four Kryo 360 Cortex A75 cores that clock at 2 GHz and four Kryo 360 Cortex A55 cores that clock at 1.6 GHz. It will include Adreno 620 graphics. Other rumored specs include Snapdragon X16 LTE modem, Spectra 260 ISP that will support up two 13-megapixel sensors or a single sensor of 2-megapixel.
The Snapdragon 640 SoC is also speculated as a 10nm chipset featuring two Kryo 360 cores and six Kryo 360 cores that respectively clock at 2.15 GHz and 1.55 GHz. It is also rumored to include Adreno 610 graphics, Spectra 260 ISP and Snapdragon X12 LTE modem.
The Snapdragon 460 is speculated to succeed the Snapdragon 450 chipset. It will be a 14nm chipset featuring four Kryo 360 cores that work at 1.8 GHz and another four Kryo 360 cores that work at 1.4 GHz. The SoC will include Adreno 605 graphics, Spectra 240 IPS and Snapdragon X12 LTE modem.
