Sony is expected to announce Snapdragon 845 powered flagship phones during the upcoming Mobile World Congress (MWC) 2018 exhibition in February. Recent leaks have revealed that the model numbers of the upcoming Sony phones are H8216, H8266, H8276 and H296. Through the UAProfile, it has been already revealed that the Sony H266 phone has a full HD resolution display and Bluetooth 5.0. It is running on Android 8.0 Oreo. The same smartphone has appeared on Geekbench benchmarking site to reveal it is a flagship device.
The above screenshot of the Geekbench listing of the Sony phone shows that it is running on Snapdragon 845 chipset and 4 GB of RAM. In the single-core test, the H266 Sony phone has scored 2393 and in multi-core test, it has scored 8300. The Geekbench listing of the Sony H266 is on par with the scores of the Samsung Galaxy S9+ that was recently spotted on the same benchmarking site earlier this week.
Speculations are rife that the H266 phone could be the next-generation Sony Xperia XZ phone. The rumor mill has already revealed the leaked render of the alleged Sony Xperia XZ2. It suggests that this phone may arrive with super-slim bezels and refreshed design.
