Xiaomi is working on the Xiaomi 13 series for China. Rumors are rife that the lineup may launch as early as this month. The series reported includes two models: the Xiaomi 13 and the Xiaomi 13 Pro. A few weeks ahead of the expected launch, CAD renders of the Pro model have appeared to reveal its design.
According to the leak, the Xiaomi 13 Pro will measure 163.0 x 74.6 x 8.8mm. The thickness of the device increases to 11.8mm at the camera bump. The height and the width of the device are almost identical to the Xiaomi 12 Pro, which measures 163.6 x 74.6 x 8.2mm.
The Xiaomi 12 Pro has a 6.73-inch display. The leak claims that the successor model could be equipped with a 6.65-inch screen. The CAD renders show that Xiaomi will not offer anything in terms of the front design of the Xiaomi 13 Pro. Like its predecessor, the 13 Pro has an OLED panel with curved edges and a centrally aligned punch-hole.
The Xiaomi 13 Pro’s back panel has a square-shaped camera module, which includes a triple camera unit and an LED flash. The prominent camera bump can be noticed in the images. The bottom edge of the device has a SIM slot, a microphone, a USB-C port, and a speaker grille. On the top, it seems to be equipped with another speaker, an IR blaster, and a microphone. The right edge of the device has a volume rocker and a power key.
The Xiaomi 13 Pro rumors have claimed that it will be one of the first phones to feature the Snapdragon 8 Gen 2 chipset. Its display will support a 2K resolution and a 120Hz refresh rate. It will have up to 12 GB of RAM and up to 512 GB of internal storage. Its rear camera setup will have a 1-inch 50-megapixel Sony IMX989 snapper, which will be accompanied by a 50-megapixel ultra-wide lens and a 50-megapixel telephoto camera. For selfies, it will have a 32-megapixel front camera. The device
