Last year in December, Xiaomi CEO Lei Jun had said during the Snapdragon Tech Summit 2017 that the next flagship phone from the company will be featuring Snapdragon 845 chipset. The rumor mill has claimed that he could be talking about the Mi 7 flagship phone. A leaked shot showing the upper portion of the alleged handset has surfaced.
The above image suggests that the Mi 7 will be arriving with a glass rear that is curved towards the edges. It seems to be featuring a metallic frame. The dual LED flash can be seen on the left on the horizontally arranged dual cameras. It appears that the Mi 7 may feature the same rear design that is available on the Mi 6. However, the major changes may be seen on the front panel of the phone.
The Xiaomi Mi 7 is rumored to feature a full screen design. It is likely to house a 6.01-inch LCD panel. It is expected to feature 6 GB of RAM and Snapdragon 845 chipset. The rumored 12-megapixel dual camera setup may include Sony IMX363 sensor. It may house a 3,500mAh battery that will carry support for wireless. It is speculated that the smartphone may debut with a pricing of 3,000 Yuan.
We advise our readers to digest this report with a pinch of lat as there is no proof to prove the authenticity of the leaked image.
