According to a new teaser released by Xiaomi, the upcoming Mi 9 Pro 5G will be arriving with a liquid cooling system under the hood, which is said to have a heat dissipation area of 1127mm².
Not only that, the device will also deploy 5 layers of graphite on the front to dissipate heat more efficiently as well. In the rear, there will also be a heat-transmitting gel and copper foil to further keep the device’s temperature. This custom cooling system designed by Xiaomi can effectively reduce the temperature of the CPU cores by as much as 10.2 Degree Celsius.
Such cooling system is significance as they help to keep the CPU running fast at a high and stable frame rate which is crucial for all mobile gamer out there. Having a high temperature on the CPU cores on the contrary, will result in laggy experience for the users.
Of course, this isn’t the only upgrades for the upcoming Mi 9 Pro 5G. The device will also feature bumped up internals including a Snapdragon 855 Plus SoC, the latest 30W Mi Charge Turbo wireless charging, 40W ultra-fast wired charging, 10W reverse charging, as well as a brand new Dreamy White color option.
