MediaTek has confirmed that it will be launching a new Dimensity chip tomorrow (March 1) in China. It can be said based on recent leaks that the Taiwanese chip maker may announce the Dimensity 8100 SoC. This chip will be positioned lower than the Dimensity 9000 flagship, which was unveiled in December 2021.
According to tipster Digital Chat Station, the Dimensity 8100 is a 5nm chip. It is an octa-core chip that includes four Cortex-A78 CPU cores clocking at 2.85GHz and four Cortex-A55 CPU cores ticking at 2.0GHz. The chip may come equipped with G610 MC6 GPU. Past reports have claimed that it may come with support LPPDR5 RAM and UFS 3.1 storage.
Rumors have it that Redmi, Realme, and OnePlus will be one of the first brands to launch Dimensity 8100 chipset powered phones. It is speculated that the upcoming Redmi K50 Pro will be powered by the Dimensity 8100 chip. As far as Redmi K50 and K50 Pro+ are concerned, these variants are rumored to be powered by the Snapdragon 870 and Dimensity 9000 chipset, respectively. The Redmi K50 series is expected to launch in March in China.
The Realme GT Neo3, which is speculated to launch next month in China, is also rumored to feature the Dimensity 8100 chipset. This phone might come with specs like a 6.7-inch AMOLED FHD+ 120Hz display, a 16-megapixel selfie camera, an OIS-enabled 50-megapixel + 8-megapixel+ 2-megapixel triple camera unit, up to 12 GB of RAM, up to 512 GB of native storage, and a 4,500mAh battery with 150W fast charging. Another variant of the phone may feature house a 5,000mAh battery with 80W rapid charging.
Tipster Digital Chat Station has claimed that OnePlus will also be launching a Dimensity 8100 powered phone. This device will come with a 6.57-inch OLED FHD+ 120Hz display with a centred punch-hole, a 50-megapixel Sony IMX766 primary rear camera, and a 4,500mAh battery with 150W fast charging support.