Qualcomm Snapdragon 730 With Dedicated NPU To Use 8MM LLP Process

Qualcomm is one of the biggest smartphone chip makers in the world. It has the Snapdragon 400 series for entry-level devices, the SD600 series for mid-range smartphone and the SD800 series for flagship devices. Recently, the company tried to breach the gap between SD6xx and SD8xx chips by unveiling the SD700 series and the first chip in this lineup is the Qualcomm Snapdragon 710 SoC which powered the recently released Xiaomi Mi 8 SE. No doubt, Qualcomm will not stop at the 710 on this series and there have been a series of rumors that the company is currently working on Snapdragon 720 chip although there is no release date for now. Now, an exclusive report from SuggestPhone has revealed that Qualcomm also has a Snapdragon 730 SoC in the works and some of the features of this chip were listed.

It only gets better for mid-range and quasi-flagship devices as the Snapdragon 730 will be built using the 8nm LPP (Low Power Plus) process. This is different from the SD710 which was created using 10nm LPE (Low Power Early) process. The 8nm LPP process improves the chip performance by 10% and it also boosts the power efficiency by 15%. This processor integrates an upgraded Spectra 350 ISP for imaging and it supports cameras up to 32MP. In addition, this chip also comes with a dedicated NPU unit which should bring an improved AI performance for its camera and some other good improvements on the Android system. Although most of the features in the SD710 and SD730 are comparable, the SD730 is expected to have a slight edge in performance.

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