In the previous year, TP-Link had unveiled Neffos X1 and Neffos X1 Max smartphones with mid-range specifications. The company is now rumored to be working on a flagship phone. A leaked image of the upcoming flagship smartphone from TP-Link has appeared.
As it can be seen in the above image, the TP-Link’s unidentified flagship has a full screen design. The exact size of the display is not known, but the elongated screen will carry support for 18:9 aspect ratio. Also, the display seems to be curved at the edges. The Neffos branding can be seen on the chin of the device. The backside of the phone is fitted with dual rear cameras and a fingerprint reader.
Rumors have it that the dual camera setup includes a 16-megapixel sensor and a 20-megapixel sensor with 2x optical zoom. It is expected to arrive with a 16-megapixel selfie camera. Since it is a flagship phone, it will be driven by Snapdragon 835 chipset and 6 GB of RAM.
TP-Link is usually known for selling budget-friendly, but the above phone seems to be a major change in strategy. There is no information on the launch date of the phone. More details on the TP-Link is expected to surface in the coming weeks.