In February, Oppo unveiled the Find N5 in China. The home market is expected to receive three more foldable phones this year, including the Honor Magic V4, Vivo X Fold 4, and Huawei X7. While Honor and Vivo’s offerings are expected to feature the Snapdragon 8 Elite chipset, Huawei’s foldable will pack a Kirin chip. However, last week’s Weibo post by tipster Digital Chat Station claimed that only one Snapdragon 8 Elite-powered foldable phone remains for the year, which is the Honor Magic V4. This led to doubts that either the Vivo X Fold 4 may have been cancelled or it may feature a different chipset. Today, DCS revealed that the X Fold 4 is indeed in the works, but with a different SoC.
Vivo X Fold 4 key details tipped
DCS hinted that the decision to use the Snapdragon 8 Gen 3 instead of the 8 Elite might be due to cost concerns. The tipster pointed out that the Snapdragon 8 Elite increases pricing by at least 1,000 Yuan, potentially making it less attractive to consumers. By sticking with the Snapdragon 8 Gen 3, Vivo can keep the price more competitive while still delivering top-tier performance.
The leak further reveals that the X Fold 4 will be a slim and lightweight device, making it one of the thinnest book-style foldables. It is expected to come equipped with a 50-megapixel periscope telephoto camera, wireless charging support, and a massive 6,000mAh battery. The phone is also said to have an IPX8 water resistance rating and a side-mounted fingerprint sensor, ensuring durability and security.
Previous reports have revealed that the Vivo X Fold 4 will feature a high-refresh-rate AMOLED display with minimal bezels and a refined hinge design to reduce the crease. The device is also likely to feature a triple-camera setup, including a 50-megapixel primary sensor, a periscope telephoto lens for zoom, and an ultra-wide camera. Fast wired and wireless charging support is also expected, making it a well-rounded premium foldable. As far as launch is concerned, it is likely to debut in June in China.
