The Snapdragon 845 is not even announced and the rumor mill has started on the successor chipset for it. Reliable leakster Roland Quandt has managed to unearth to some information on the Snapdragon 855 through the Linkedin profile of a Qualcomm software engineer named George Fang.
Fang’s profile has revealed that the Snapdragon 845 that has a description of “a complex SoC of a latest mobile processor (SDM 845) owned by Qualcomm” carries a codename of Napali v2.0. Rumors have revealed that it is the second-generation 10nm chipset from Qualcomm.
It is interesting to know that Qualcomm may have already started working on Snapdragon 855 chipset as Fang’s Linkedin profile describes it as “a latest processor (SDM855 series) owned by Qualcomm” and it is codenamed as Hana v1.0. Rumors have it that it is 7nm chipset that will be powering flagship phones in 2019.
Speculations have it that TSMC will be manufacturing the 7nm Snapdragon 855, and not Samsung. A Chinese leakster has revealed that it is low power consuming chipset and the smartphones that will be powering will feature ultrasonic fingerprint sensor under the screen. The SoC is also speculated to deliver 30 to 40 percent improved performance than SD 845. It is also expected to carry AI capabilities.