MediaTek’s has quietly announced their latest G-series gaming chip known as the Helio G70. This will be a watered-down version of the current Helio G90 SoC, and is expected to be found among some of the upcoming mid-ranger smartphones including the Redmi Note 9.
For starter, the Helio G70 SoC is built upon an octa-core architecture which comprises of a pair of Cortex-A75 CPUs (clocked at 2GHz) and six Cortex-A55 CPUs (clocked at 1.7GHz). In terms of graphics, there will also be a Mali-G52 GPU operating at up to 820MHz.
According to MediaTek, there will be an essential piece of technology known as CorePilot within the chip which provides advanced monitoring, task scheduling and performance optimizations for the processor. This will ensure help to ensure that the CPU cores within the processor are being used in the most efficient manner.
Moving on, the Helio G70 will be able to support up to 8GB of LPDDR4X memory (@1800MHz), as well as eMMC 5.1 storage. It can produce a maximum screen resolution of 1080 x 2520 pixels on smartphones as well.
On the photography end, the ISP for the Helio G70 is able to support up to 48 megapixels for single-camera sensor, or 16MP+16MP for dual-camera sensors.
In order to enhance the photography experience of it’s users, there are also advanced hardware including dedicated depth engine, Camera Control Unit (CCU), Electronic Image Stabilization (EIS) and Rolling Shutter Compensation (RSC) technology that enhances video panning and ultra-fast recording (up to 240fps).
Unlike the recently announced Dimensity 800 SoC, the Helio G70 will not support 5G connectivity. However, it will be able to support most of the common connectivity options including 4G Carrier Aggregation (CA), dual 4G VoLTE, Wi-Fi 5 and Bluetooth 5.0.