Today, MediaTek held a launch event in China to announce the Dimensity 1200 as its first 5G-ready chip for 2021. The SoC has arrived as the successor to the Dimensity 1000+ SoC chipset that drove many upper mid-range 5G-enabled smartphones such as iQOO Z1, Redmi K30 Ultra, Realme X7 Pro, and OPPO Reno5 Pro 5G in China.
The MediaTek Dimensity 1200 is the company’s first 6nm chipset. It can deliver up to 3GHz clocking speeds and comes with dual 5G SIM support. The company also announced another 6nm chip called the Dimensity 1100 SoC today as a slightly weaker edition of the Dimensity 1200.
Dimensity 1200 and 1100 specifications and features
MediaTek adopted a 1+3+4 configuration for the Dimensity 1200 chipset. The octa-core chipset includes 1 x ARM Cortex-A78 CPU running at up to 3GHz, 3 x ARM Cortex-A78 CPU cores working at up to 2.6GHz, and an ARM Cortex-A55 CPU ticking at up to 2GHz.
In comparison, the Dimensity 1100 lacks the prime core found in the Dimensity 1200 chip. It comprises of 4 x ARM Cortex-A78 CPU clocking at up to 2.6GHz and 4 x Cortex-A55 CPU ticking at up to 2GHz. Both chipsets include Mali-G77 MC9 graphics.
The Dimensity 1200 and Dimensity 1100 chipsets support FHD+ and QHD+ resolutions. While the D1200 powered phones can support up to 168Hz refresh rate, the D1000 driven smartphones can support up to 144Hz refresh rate. Both SoCs come with support for common features like up to 16GB of LPPDR4x RAM, UFS 3.1 storage, APU 3.0, Wi-Fi 6, dual-frequency GPS, Bluetooth 5.2, and up to 32-megapixel + 16-megpixel dual camera system. While the D1200 chip phones can feature camera sensors up to 200-megapixel, the D1100 SoC can support up to 108-megapixel single camera.
Xiaomi, OPPO, Vivo, and Realme are some of the companies that are going to launch Dimensity 1200 and 110 powered phones in near future. The first phones featuring the new chips are expected to break cover by late March or early April.