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Xiaomi Mi CC10 phone casings leaked again

Last week, we’d seen the possible design of the upcoming Xiaomi Mi CC10 via its screen protector listing which popped up at e-commerce giant Alibaba.

Right now, the alleged phone casings of the Xiaomi Mi CC10 had appeared on Taobao as well. Coincidentally, the rear design of the Mi CC10 depicted in the renders here resemble what we’d seen earlier on.

If that’s the case, then we can expect the upcoming Mi CC10 to arrive with a circular camera module at the back which has four cameras arranged in a diamond-shape fashion. This will be assisted by a LED flash located directly below the camera module.

Though the phone casing renders didn’t reveal the front design of the handset, but its earlier screen protector listing had already confirmed that the Mi CC10 will be employing a hole-punch design.

In terms of specs, a recent leak had suggested that the upcoming Mi CC10 smartphone series will feature an advanced camera system. It was claimed that the device could be featuring a brand new 108MP Samsung HMS sensor and will be able to support up to 12x optical zoom and 120x hybrid zoom.

Other than that, the Mi CC10 was also speculated to sport the unannounced Snapdragon 775G SoC which will be succeeding the current SD765G SoC.


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