Oppo is expected to unveil the Oppo Find X9 series of smartphones in September or October this year in China. The lineup will include at least two models, the Find X9 and X9 Pro. Recent reports have revealed many details about both smartphones. A new Weibo post by reliable tipster Digital Chat Station reiterates several details about the X9 Pro
Oppo Find X9 Pro key specifications (rumored)
The above leak suggests that the engineering prototype of the Oppo Find X9 Pro features the upcoming Dimensity 9500 chipset. He revealed that the chipset, which is said to be built with TSMC’s advanced N3P+ process, has a CPU clock speed exceeding 4GHz. He added that the performance feedback so far appears promising, and further observation is recommended.
The tipster has reiterated that the Oppo Find X9 Pro features a 200-megapixel periscope telephoto lens backed by a large camera sensor. Interestingly, the module’s size is said to be more compact than expected, suggesting good optimisation.
Recent reports have claimed that the Find X9 Pro could be equipped with a 200-megapixel Samsung HP5 periscope camera. It will be joined by a 50-megapixel main camera and a 50-megapixel ultra-wide lens. It is speculated that the X9 series will adopt a rectangular or square-shaped camera module positioned at the upper-left corner instead of the circular camera module that was used on the Find X8 series.
As for the display, the device is described as having a 1.5K flat panel with large, symmetrical R-corner bezels on all sides, which contributes to a clean and balanced look. The engineering model being tested is in a white color variant, possibly using fibreglass or glass materials.
To recall, the Find X8 Pro featured a dual periscope setup. However, the Find X9 Pro is expected to feature a single periscope, indicating that the dual periscope solution could be exclusive to the Find X9 Ultra. It is speculated that the X9 Pro will feature a 6.78-inch display equipped with an ultrasonic in-screen fingerprint sensor.
